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- Heat Spreader for Trenz Electronic MPSoC-Module TE0807-04 (KK0807-04)* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z015-1CLG485I, 1 GByte DDR3L, 4 x 5 cm* Exkl. MwSt. exkl. Versandkosten
- CYC1000 with Cyclone 10 FPGA, 8 MB SDRAM, 8 MB Flash, 6.15 x 2.5 cm* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 4 x 6 cm* Exkl. MwSt. exkl. Versandkosten
- High-Performance Xilinx Zynq Z-7045-Modul, 1 GByte DDR3, 8,5 x 8,5 cm* Exkl. MwSt. exkl. Versandkosten
- UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+ (TEBF0808-05)* Exkl. MwSt. exkl. Versandkosten
- Carrier Board for Trenz Electronic TEM0005 Microsemi SmartFusion2 SoC* Exkl. MwSt. exkl. Versandkosten
- Testboard for the Trenz Electronic MPSoC module TE0865 (TEBT0865-01)* Exkl. MwSt. exkl. Versandkosten
| The micromodules designed by Trenz Electronic feature modern Xilinx FPGAs. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC. |
