Alinx Electronic Limited

AXU3EGB Dev Board & Kit with AMD Zynq US+ MPSoC XCZU3EG

System-on-Module ● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC: ◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz ◆ ARM® dual-core Cortex™-R5 up to 533 MHz ◆ Mali-400MP2 GPU (only for ZU3EG/ZU4EV/ZU5EV) ◆ H.264 / H.265 Video Codec (only for ZU4EV/ZU5EV) ◆ 16nm FinFET+ FPGA fabric ● Pluggable module with 4 x Panasonic board-to-board connectors ● 4 GByte (64-bit) DDR4 SDRAM on PS (ZU2CG is 2 GByte) ● 1 GByte (16-bit) DDR4 SDRAM on PL (only for ZU3EG/ZU4EV/ZU5EV) ● 32 MB QSPI Flash ● 8 GB eMMC Flash Base Board ● 1 x M.2 Card slot on PS ● 1 x DP Interface on PS ● 1 x 2 lane MIPI on PL ● 2 x CAN on ps ● 2 x RS485 Interfaces on PL ● 2 x USB3.0 on PS + 2 x USB2.0 on PS ● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75) ● 2 x Gigabit Ethernet (1 x PS + 1 x PL) ● 2 x UART (1 x PS + 1 x PL) (USB to UART) ● 1 x Micro SD ● 1 x RTC (Real-time clock) ● 2 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.) ● LED (1 x pwr + 1 x PL + 1 x PS) + KEY (1 x RST + 1 x PS + 1 x PL) ● 12V single supply ● Dimensions: 160 x 100 mm form factor


Item number VAR-827002863


Possible to order. Out of Stock, restocking in progress
Expected dispatch delay beyond available stock: 1 week

Located in: Germany


EUR 486.91 *
Content 1 piece

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The AXU2CGB-E/3EGB/4EVB-E/5EVB-E development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, DP, M.2, USB 3.0, CAN, RS485, MIPI, UART. Provide high-speed storage (M.2) and video applications (DP).

Item ID 102423
Condition New
Legacy item ID
Model AXU3EGB
Manufacturer Alinx Electronic Limited
Manufacturing country China
Content 1 piece
Weight 1000 g
Net weight 1000 g
Customs tariff number 8471 8000 00 0

Applications ● Artificial Intelligence ● Automotive ● AV Broadcasting ● Deep learning ● Digital Signal Processing ● 5G Wireless and Wire Communication ● Data Centers ● Drive / Motion Control ● Industrial Internet of Thing ● Cloud Computing Security ● Machine Vision ● Medical Endoscop ● Video and Image Processing