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BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
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Trenz Electronic GmbH
MPSoC Module with AMD Zynq™ UltraScale+™ ZU2CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm(TE0813-02-2AE81-A)
AMD/Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connectors, size: 5.2 x 7.6 cm
Item number VAR-827002622
Manufacturer Product Number: TE0813-02-2AE81-A
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
EUR 291.41
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Content
1 piece
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Item ID | 102223 |
Condition | New |
Legacy item ID | 3768 |
Model | TE0813-02-2AE81-A |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 67 g |
Net weight | 67 g |
Customs tariff number | 84718090 |
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